JPH01278098A - チップ状回路部品配置装置 - Google Patents
チップ状回路部品配置装置Info
- Publication number
- JPH01278098A JPH01278098A JP63108068A JP10806888A JPH01278098A JP H01278098 A JPH01278098 A JP H01278098A JP 63108068 A JP63108068 A JP 63108068A JP 10806888 A JP10806888 A JP 10806888A JP H01278098 A JPH01278098 A JP H01278098A
- Authority
- JP
- Japan
- Prior art keywords
- component
- suction
- circuit
- circuit component
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007664 blowing Methods 0.000 claims abstract description 5
- 230000008859 change Effects 0.000 abstract description 2
- 239000011159 matrix material Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000003463 adsorbent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63108068A JPH01278098A (ja) | 1988-04-28 | 1988-04-28 | チップ状回路部品配置装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63108068A JPH01278098A (ja) | 1988-04-28 | 1988-04-28 | チップ状回路部品配置装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01278098A true JPH01278098A (ja) | 1989-11-08 |
JPH0586079B2 JPH0586079B2 (en]) | 1993-12-09 |
Family
ID=14475067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63108068A Granted JPH01278098A (ja) | 1988-04-28 | 1988-04-28 | チップ状回路部品配置装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01278098A (en]) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0399498U (en]) * | 1990-01-31 | 1991-10-17 | ||
JPH0399497U (en]) * | 1990-01-31 | 1991-10-17 | ||
JPH0399494U (en]) * | 1990-01-31 | 1991-10-17 | ||
JPH0399495U (en]) * | 1990-01-31 | 1991-10-17 | ||
JPH04123496A (ja) * | 1990-09-14 | 1992-04-23 | Matsushita Electric Ind Co Ltd | テーピング部品の位置規正方法 |
US10994951B2 (en) | 2018-07-19 | 2021-05-04 | Seiko Epson Corporation | Electronic component handler and electronic component tester |
-
1988
- 1988-04-28 JP JP63108068A patent/JPH01278098A/ja active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0399498U (en]) * | 1990-01-31 | 1991-10-17 | ||
JPH0399497U (en]) * | 1990-01-31 | 1991-10-17 | ||
JPH0399494U (en]) * | 1990-01-31 | 1991-10-17 | ||
JPH0399495U (en]) * | 1990-01-31 | 1991-10-17 | ||
JPH04123496A (ja) * | 1990-09-14 | 1992-04-23 | Matsushita Electric Ind Co Ltd | テーピング部品の位置規正方法 |
US10994951B2 (en) | 2018-07-19 | 2021-05-04 | Seiko Epson Corporation | Electronic component handler and electronic component tester |
Also Published As
Publication number | Publication date |
---|---|
JPH0586079B2 (en]) | 1993-12-09 |
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